DIP

가장 많이 사용되는 타입
,pitch는 2.54mm

 SIP

 패키지 한쪽에만 Lead가 일렬 수직으로 있는 타입

 ZIP

Lead가 교대로 지그재그 모양, Lead pitch는 1.27mm(50mil).

PGA

 패키지의 Lead가 Body 바닥 전면이나 일부 사각배열 수직으로 달려 있습니다

SOP,SOIC

Lead pitch는 1.27mm(50mil)이며 Lead는 8-44개 

 TSOP

SOP에 비해서 두께가 얇은SOP,pitch가 1.27mm(50mil) 이하

SSOP

축소된 소형 SOP,Lead pitch가 1.27mm보다 작음 Lead는 8-80

TSSOP

 Body 두께가 1.0mm 이하며,Lead pitch는 0.65, 0.5mm인

QFP

 Lead pitch는 1.0/0.8/0.65/0.5/0.4/0.3mm까지 가능

 QFN

QFP와 비슷 Lead가 밖으로 나와 있지 않음 밑면 네 변에 전극 패드가 나열

 QFJ,PLCC

 Lead가 안쪽으로 구부러져 있는 'J' 자형, pitch는 1.27mm 

SOJ

QFJ + SOP라고 생각하시면 됩니다, pitch는 1.27mm

 BGA

 Lead대신 뒷면에 납땜을 할 수 있는 납땜볼이 Array 형태,

SOT-23-5

SCT-595-5

SOT666

TO-92

TO100-10

TO-220